Mediatek has just presented its new high-end SoC that has prepared for the next 2020 the new MediaTek Dimensity 1000. A chip on which Mediatek has high hopes and intends to compete with the powerful Huawei Snapdragon 855+ and Kirin 990 5G although as always we will see how it works in the real world. This new SoC will be manufactured in 7nm, adopts the new 5G technology with Dual SIM and a 6-core iA processor with a performance of 4.5 TOPS.
The MediaTek Dimensity 1000 includes a cluster of 4 ARM Cortex-A77 processors capable of reaching 2.60Ghz and another cluster of 4 ARM Cortex-A55 processors that reach 2.00Ghz. The GPU for its part is a 9-core ARM Mali-G77 MC9 with display support of up to a resolution of 2520 x 1080 pixel and native decoding of the Google AV1 codec.
Also can support up to 16GB of LPDDR4x RAM memory, UFS storage, WiFi 6 (2T2R 802.11ax), Bluetooth 5.1 and FM Radio. You can also handle cameras up to 80MP and capture 4K@60fps video thanks to its 5-core ISP that includes multiple optimizations. For its part, its 5G modem is capable of reaching speeds of up to 4.7Gbps in download and download of up to 2.5Gbps.
- The new MediaTek Dimensity 1000 Octa Core SoC will be available in the first quarter of 2020, we will see it in the MWC.
