MediaTek has just presented its new SoCs for mid-range smartphones Dimensity 920 and Dimensity 810 that as usual incorporate 5G connectivity.
Some interesting chips for the most popular range where we see that the Dimensity 810 also makes the leap to the 6 nm manufacturing process, which makes the improvement over the Dimensity 800 reaches 20% but still a little below the Dimensity 820. The Dimensity 920 SoC continues with the 7 nm manufacturing process and the improvement over the Dimensity 900 does not reach 10%.
MediaTek Dimensity 920
The MediaTek Dimensity 920 is an Octa Core SoC with 4 high performance ARM Cortex-A78 processors reaching 2 GHz + 4 low power ARM Cortex-A55 processors reaching 2 GHz top speed and a Mediatek 3.0 APU for iA acceleration. The GPU is an ARM Mali-G68 MC4 that provides support for displays up to FullHD+ resolution and 120 Hz refresh.
This chip also supports LPDDR5 and LPDDR4x RAM, UFS 3.1 storage memory and includes GPS, WiFi AX and Bluetooth 5.2 as standard. In the field of cameras, it can handle up to four cameras at a time or one 108MP camera. This chip is also renewed in its engine for game optimization, as the MediaTek HyperEngine reaches version 3.0.
MediaTek Dimensity 810
The MediaTek Dimensity 810 is also an Octa Core with 4 high-performance ARM Cortex-A76 processors reaching 2.4 GHz + 4 low-power ARM Cortex-A55 reaching 2 GHz top speed. The GPU is an ARM Mali-G57 MC5 that provides support for displays up to FullHD+ resolution and 120 Hz refresh.
This SoC also supports LPDDR4x RAM, UFS 2.2 storage memory and includes as standard, GPS, Wifi 5 and Bluetooth 5.1. On the camera front it can handle up to two cameras at a time or one 64MP camera.
Market availability
- The two new MediaTek Dimensity 920 and Dimensity 810 SoCs will hit the market before the end of this quarter, so we will soon have smartphones armed with these new budget chips.
