It seems that the new SoC of Qualcomm Snapdragon 710 and Snapdragon 730 of its new 700 series are taking shape in leaps and bounds as now they have leaked their full specifications. A few new data now where the AI win force, this products would be manufactured by Samsung and could reach the market later this year.
Snapdragon 710
An Octa Core SoC manufactured in 10nm LPE that includes a cluster of 2 Kyro 3xx processors able to reach 2.2Ghz and 6 Kyro 3xx processors able to reach 1.7Ghz and an Adreno 615 GPU capable of reaching 750Mhz. A SoC capable of supporting screens with resolutions of up to 3040 × 1440 pixels, HDR and recording 4K video at 60fps. This chip will include support for up to 3 cameras simultaneously and will have an ISP Spectra 250. It will also support up to 32GB of RAM and includes integrated WiFi 2 × 2 aC and Bluetooth 5.0.
Snapdragon 730
An Octa Core SoC more powerful than the 710 that makes the leap to manufacturing in 8nm LPP, would also include a pair of clusters with processors tuned by Qualcom Kyro4xx that reach higher speeds and the same GPU ADRENO 615. The improvements are also seen in the Bluetooth connectivity that is now the version 5.1 and AI level that now includes a NPU 120. We also have improvements in photography since this chip includes a more powerful ISP as the Spectra 350 would be and adds support for FS2 sensors, which certainly not We know what improvements it includes.
