Qualcomm has just presented its new SoC the Snapdragon 855, a new chip, until now known as 8150, which will be the flagship of this company’s in 2019. The new Snapdragon 855 will be manufactured in 7nm by TSMC thus equalizing technology of manufacture to the Kirin 980 or to the last Apple SoC. As news we have a new NPU that triples its power in AI and that will have a utility centered mainly in the improvement of audio and video, an ultrasonic fingerprint reader under the screen and a new and expected 5G modem with low latencies and download speeds up to 5Gbps. At the moment we do not have all the characteristics of this new SoC that we assume will be published in the coming days.
The Snapdragon 855 is an Octa Core with three Clusters, the first with a single processor Kryo Gold Prime capable of reaching 2.8Ghz, a second cluster with 3 Kryo Gold processors that reach 2.4 Ghz and finally a cluster of low consumption equipped with 4 Kryo Silver processors that reach 1.7Ghz. The GPU in this case is an Adreno 640 from Qualcomm itself. It will also include in addition to the 5G modem a 4G modem of the company itself the X24 an old friend.
- We will see the Snapdragon 855 during the first half of 2019 and will be integrated in the flagships of the best brands of smartphones that we will see live at the next MWC in Barcelona.