Qualcomm has just presented its new top-end SoC of its Snapdragon 845 Mobile Platform, a chip oriented to the most premium smartphones and we will surely see it moving the next Samsung Galaxy S9 or Xiaomi Mi 7. A SoC that stands out for its manufacture in 10 nm LP FinFET and no how could it be otherwise is loaded with new features in the technological aspect.
Snapdragon 845 is an Octa Core that includes a pair of managed clusters with DinamiQ technology, the first with 4 Kyro 385 Gold processors (custom version of the Cortex-A75) capable of reaching 2.8Ghz and a second cluster with 4 Kyro 385 Silver processors (custom version of the Cortex-A55) that reach 1.8Ghz. The GPU in this SoC is the Adreno 630 that according to the brand, improves the performance of the Adreno 540 GPU by 30%. Snapdragon 845 maintains support for up to 8 GB of LPDDR4x RAM and support for screens with up to 4K 60fps resolution. The modem makes the jump to the new model X20 with capacity of up to 1200 Mbps download speeds and 150 Mbps upload while fast charging also takes a step forward with the Quick Charge 4+ protocol that promises to charge the battery to 50% in 15 minutes.
The Snapdragon 845 also adds different technologies from Qualcomm as its Secure Processing Unit (SPU) for security, the Qualcomm Spectra 280 chip for video or the DSP Hexagon 685 processor that allows recording 4K video at 60fps and support HDR10, HLG in addition to H.265 (HEVC). Qualcomm also gives special importance to the improvements in AI functions to facilitate the use of the device and the increase in power for virtual reality that they call eXtended Reality (XR), an area that is certainly more oriented to marketing than to a use practical from day to day. Surely in this next MWC 2018 we will see all the flagships with this new high-end SoC.